Packaging Design Engineer

We are now looking for more tech wizards to join our R&D Department in Gothenburg! 

What you will do

Working as a Design Engineer, within the field of semiconductor packaging, you will take an active role in exploring new assembly concepts and designing cutting edge products for the smartphone industry. You will belong to a small and dedicated team, with the responsibility to develop packaging solutions for the next generation of capacitive fingerprint sensors, and new in-display optical sensors.

Your tasks may range from identifying new and improved materials, optimizing assembly methods, analyzing reliability, approaching material suppliers in Asia and organizing evaluation builds. You will also be part of verifying new product concepts, supporting product industrialization, or submitting new inventions for patent filing.

This role is specifically focused towards knowledge in materials used for optical image sensor systems, i.e. polymers/adhesives/glass/molded materials, and how to optimize the material stack up to maximize the end user experience.

Who you are

• You are a true team player with a positive problem solving attitude
• You are curious and open to learn new things
• You bring your ideas and willingly share your knowledge with others
• You are able to drive assignments independently and to self-manage priorities
• You have a technical education, such as PhD, Master or Bachelor in physics or electronics, or equivalent
• You have previous experience from development projects for hardware products
• You have relevant occupational experience with semiconductor materials, or a similar field, is advantageous
• Prior involvement with subcontractors, domestic or international, is also valuable
• You are fluent in spoken and written English and are flexible when it comes to international traveling

At Fingerprints we value our differences and believe that diversity makes us better. It is important is that you bring a positive attitude together with a friendly and team-oriented approach. We believe in involvement and hope that you want to help us continue to build our culture of Smart, Brave, Open and United friends at Fingerprints!

Sounds interesting?

Hurry up and apply today via our career page, the sooner the better, but no later than July 31st, 2019. The selection process will start as soon as we receive applications. https://corporate.fingerprints.com/en/about-fpc/carreer/vacant-positions/  

Curious to learn more about this job opportunity? Contact recruiting manager, Mats Slottner, Director Microelectronic Packaging Development, +46 733 607838 Mats.slottner@fingerprints.com